8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole

8 Layer HDI Printed Circuit Board , Blind And Buried Holes , 1.0MM , FR4 IT180A Material

8 Layer Printed Circuit Board With Blind And Buried Holes

PCB Specifications:

Layer Count: 4Layer Half Plated Hole PCB

Board Thickness: 1.0MM

Material: FR4 IT180A

Min Hole: 0.1MM

Min Line: 3/3 Mil

BGA Size: 8Mil

Unit Size: 122*114MM/12UP

Blind Holes: L1-L2 , L7-L8 0.1MM

Buried Holes: L2-L3 , L6-L7 0.1MM , L3-L6 0.2MM

Via Holes: L1-L8 0.8MM

Min Distance Between Inner Layer Line to Holes: 6Mil

Solder Mask: Green

Surface Treatment: ENIG+OSP(OSP for BGA Pads)

Special Treatment: Half Plated Holes

Application: GPS Module

Other PCB Show:

FAQ:

Question: What is the most common quality issue for this kinf of pcb?

Answer: 1) Copper burr in half holes

2) Oxidation in half holes

Question: Why use surface treatment ENIG+OSP?

Answer: OSP has good tin solder paste feature . The BGA size is only 8mil. If use immersion gold, it's not good for tin solder paste. So we suggest customer to use ENIG+OSP. It can protect other pads well and meanwhile, it makes sure that the BGA pads have good tin solder paste feature.

Question: Is the cost for ENIG+OSP higher than ENIG?

Answer: Yes it is. But it won't make a big difference.

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8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole Images